It also explains why the bottleneck conversation is migrating away from CoWoS, which is finally easing, and onto memory,…
SemiAnalysis Twitter · SemiAnalysis (@SemiAnalysis_) · 2026-05-30
SemiAnalysis notes that the AI hardware supply bottleneck has shifted from CoWoS advanced packaging, which is easing, to HBM memory, where wafer supply cannot keep up with demand due partly to smartphone allocation tradeoffs.
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Extraction
Topics: ai-hardwarehbm-memorysemiconductor-supplyadvanced-packaging
Claims
- CoWoS packaging supply is no longer the primary constraint on AI accelerator production.
- HBM memory wafer supply has become the new binding constraint on frontier AI hardware.
- Smartphone production competes with AI accelerators for HBM wafer allocation, creating real tradeoff scenarios.
- Full HBM reallocation scenarios are analyzed in a referenced SemiAnalysis article.
Key quotes
The bottleneck conversation is migrating away from CoWoS, which is finally easing, and onto memory, where wafer supply can't keep up with HBM demand.
The smartphone allocation tradeoff is real, and the full reallocation scenarios are in the article.