Intel Foundry's EMIB plus 18A-P/T is positioned as a multi-billion-dollar external franchise into 2028. New entrants sti…

SemiAnalysis Twitter · SemiAnalysis (@SemiAnalysis_) · 2026-06-01

Intel Foundry is positioning its EMIB advanced packaging technology and 18A-P/T process nodes as a multi-billion-dollar external revenue franchise through 2028, while new entrants including Rapidus, Tata, Huawei, and a Tesla-SpaceX joint venture push into semiconductor manufacturing.

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Topics: semiconductor-foundryintel-foundryadvanced-packagingsemiconductor-competition

Claims

Intel Foundry's EMIB advanced packaging combined with its 18A-P/T process nodes is positioned as a multi-billion-dollar external revenue franchise through 2028.
New foundry entrants including Rapidus (targeting 2nm/1.4nm), Tata (mature nodes), Huawei (Tau Scaling), and a Tesla-SpaceX joint venture called Terafab are entering the market.
Tesla-SpaceX Terafab is targeting one million wafers per month spanning logic, memory, and additional segments.

Key quotes

Intel Foundry's EMIB plus 18A-P/T is positioned as a multi-billion-dollar external franchise into 2028.

New entrants still pushing into foundry. Rapidus (2nm/1.4nm), Tata (mature), Huawei (Tau Scaling), and Tesla-SpaceX Terafab targeting 1M wafers/month across logic, memory