The Bottom Line: SPHBM4 shifts the complex engineering burden of AI chips.
SemiAnalysis Twitter · SemiAnalysis (@SemiAnalysis_) · 2026-07-03
SemiAnalysis concludes that SPHBM4 shifts AI chip engineering complexity from expensive silicon interposers to ABF and glass substrates, marking the start of a major substrate industry growth wave.
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Extraction
Topics: sphbm4ai-chip-packagingsubstratessemiconductor-manufacturing
Claims
- SPHBM4 eliminates the need for expensive proprietary silicon interposer and ABF substrate combinations.
- Chipmakers will shift to ultra-large, high-layer ABF substrates or glass substrates as performance requirements migrate to the substrate layer.
- Glass substrate adoption may be pulled forward as a direct result of SPHBM4's architectural demands.
- The substrate industry is entering a sustained growth phase driven by SPHBM4 adoption.
Key quotes
Instead of buying a hyper-expensive, proprietary 'Silicon Interposer + ABF Substrate' combo, chipmakers will shift entirely to buying ultra-large, high-layer ABF or even pull forward the adoption of glass substrates as performance requirements are pushed directly onto the substrate layer.
The substrate boom is just getting started.