Google's next TPU, codenamed Humufish, is set to use Intel's EMIB-T instead of TSMC CoWoS.
SemiAnalysis Twitter · SemiAnalysis (@SemiAnalysis_) · 2026-07-01
SemiAnalysis reports that Google's next AI training chip, internally codenamed Humufish, will use Intel's EMIB-T advanced packaging instead of TSMC's dominant CoWoS process, marking the first major departure from TSMC's packaging monopoly on leading AI accelerators.
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Extraction
Topics: google-tpusemiconductor-packagingintel-emibtsmc-cowosai-hardware
Claims
- Google's next TPU, codenamed Humufish, is designed to use Intel's EMIB-T packaging instead of TSMC CoWoS.
- Nearly every leading AI training accelerator currently uses TSMC's CoWoS 2.5D packaging flow.
- CoWoS places all dies on a single large silicon or RDL interposer, while EMIB embeds small silicon bridges directly in the organic substrate only where die-to-die links are needed.
Key quotes
Google's next TPU, codenamed Humufish, is set to use Intel's EMIB-T instead of TSMC CoWoS.
Nearly every leading AI training accelerator today is packaged on a TSMC 2.5D flow, and almost all of it is CoWoS. CoWoS is the industry default, which is exactly why a flagship part moving off it is worth attention.