The Information Machine

Google Humufish TPU Abandons TSMC CoWoS for Intel EMIB-T Advanced Packaging

Synthesis history

4 versions, newest first.

  1. Version 4 2026-07-07 08:20 UTC · 102 items

    New items this pass are amplification without new factual content: secondary trade site reposts, a YouTube explainer, a Yahoo Finance syndication, a SemiAnalysis social media post, and a SemiWiki forum thread. The SemiW…

  2. Version 3 2026-07-04 02:25 UTC · 97 items

    TrendForce reports MediaTek is adopting a dual Intel EMIB / TSMC CoWoS packaging strategy for its AI ASIC designs,[^39285] making it the first reported second major customer exploring EMIB for production use and adding …

  3. Version 2 2026-07-02 18:17 UTC · 89 items

    SemiAnalysis published follow-up analysis drawing on ECTC 2026 conference disclosures, adding concrete technical specifics: Intel has validated EMIB-T at 36/35 µm bump pitch on 2× reticle packages and is expanding to 4.…

  4. Version 1 2026-07-01 08:12 UTC · 64 items

    Google's next-generation TPU, codenamed Humufish (TPU v8e), is reported to use Intel's EMIB-T advanced packaging rather than TSMC's CoWoS — the standard for virtually every current AI training accelerator.[^37402] Googl…